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BST-705A Solder paste: Sn99/Ag0.3/Cu0.7,φ50*16mm,N.W.:50G; High tempt: 217℃
BST-705A Solder paste: Sn99/Ag0.3/Cu0.7,φ50*16mm,N.W.:50G; High tempt: 217℃
4.2 / 5.0
(38) 38 total reviews
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Quick Details
Product Name: Solder Paste
Application: Welding Operations
Melting point: 217℃
Material: solder paste
Usage: for welding work
Product Details
- NON-CORROSIVE: Rosin is not conductive in dry conditions and has good insulation. Is not corrosive to metal substances such as circuit boards.
- OXIDATION RESISTANCE: Anti-oxidation effect on soldering iron head of gold-copper alloy substrate. Solder flux for semi-solid, not easy to dump.
- STRONG APPLICABILITY: Flux is suitable for welding instruments, gold, copper, tin, iron and other metals. Ideal for electronic welding, repair and rework.
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